Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs
Brand: Thermaltake
MPN: CL-O023-GROSGM-A
Brand: Thermaltake
MPN: CL-O023-GROSGM-A
- Prop 65 Warning:
- WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov.
